Vol. 4, No. 10, 2009

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ISSN: 1559-3959
Evaluation of film-substrate adhesion via impact using coated bullets

Chen-Wu Wu, Zhi-Lin Wu, Kun Zhang and Guang-Nan Chen

Vol. 4 (2009), No. 10, 1703–1709
Abstract

A method was devised to evaluate the adhesion between a film and a substrate. A front-end coated bullet is accelerated by a gas gun and hits the substrate of the specimen under test. The impact generates a compressive stress pulse that propagates toward the film. After transmission through the interface, part of the pulse is reflected on the free surface of the film, and tensile stress arises at the film-substrate interface, possibly inducing debonding of the film.

This dynamic process was demonstrated analytically and simulated numerically by the finite element method. The results validate the initial concept and lay the foundation for further optimization of this method.

Keywords
adhesion, film, substrate, coated bullet, impact
Milestones
Received: 2 November 2008
Revised: 2 April 2009
Accepted: 2 June 2009
Published: 27 February 2010
Authors
Chen-Wu Wu
Institute of Mechanics
Chinese Academy of Sciences
15 Beisihuanxi Road
Beijing 100190
China
Zhi-Lin Wu
School of Mechanical Engineering
Nanjing University of Science and Technology
Nanjing 210094
China
Kun Zhang
Institute of Mechanics
Chinese Academy of Sciences
15 Beisihuanxi Road
Beijing 100190
China
Guang-Nan Chen
Institute of Mechanics
Chinese Academy of Sciences
15 Beisihuanxi Road
Beijing 100190
China