A partial differential equation (PDE)-based model combining the effects of surface
electromigration and substrate wetting is developed for the analysis of the morphological
instability of a monocrystalline metal film in a high temperature environment typical
to operational conditions of microelectronic interconnects and nanoscale devices. The
model accounts for the anisotropies of the atomic mobility and surface energy. The
goal is to describe and understand the time-evolution of the shape of the film surface.
The formulation of a nonlinear parabolic PDE problem for the height function
of the film in
the electric field is presented, followed by the results of the linear stability analysis of a planar
surface. Computations of a fully nonlinear evolution equation are presented and discussed.