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Evaluation of
film-substrate adhesion via impact using coated bullets
Chen-Wu Wu, Zhi-Lin Wu, Kun Zhang and Guang-Nan Chen |
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Vol. 4 (2009), No. 10, 1703–1709
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Abstract |
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A method was devised to evaluate the adhesion between a film and a substrate. A front-end coated bullet is accelerated by a gas gun and hits the substrate of the specimen under test. The impact generates a compressive stress pulse that propagates toward the film. After transmission through the interface, part of the pulse is reflected on the free surface of the film, and tensile stress arises at the film-substrate interface, possibly inducing debonding of the film. This dynamic process was demonstrated analytically and simulated numerically by the finite element method. The results validate the initial concept and lay the foundation for further optimization of this method. |
Keywords
adhesion, film, substrate, coated bullet, impact
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Milestones
Received: 2 November 2008
Revised: 2 April 2009
Accepted: 2 June 2009
Published: 27 February 2010
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Authors |
| Chen-Wu Wu | |
| Institute of Mechanics Chinese Academy of Sciences 15 Beisihuanxi Road Beijing 100190 China |
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| Zhi-Lin Wu | |
| School of Mechanical
Engineering Nanjing University of Science and Technology Nanjing 210094 China |
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| Kun Zhang | |
| Institute of Mechanics Chinese Academy of Sciences 15 Beisihuanxi Road Beijing 100190 China |
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| Guang-Nan Chen | |
| Institute of Mechanics Chinese Academy of Sciences 15 Beisihuanxi Road Beijing 100190 China |
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