Vol. 14, No. 1, 2019

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Thermal stress around an elliptic hole weakened by electric current in an infinite thermoelectric plate

Kun Song, Hao-Peng Song, Peter Schiavone and Cun-Fa Gao

Vol. 14 (2019), No. 1, 179–191
Abstract

We propose effective strategies to manage thermal stress around an elliptic hole induced by electric current and heat flux in a thermoelectric material. Our results indicate that the thermal stress can be reduced dramatically, with little influence on conversion efficiency, by simply adjusting the value of the electric current. In fact, we find that additional electric current in the vertical direction can totally neutralize the thermal stress at a particular point, including the thermal stress singularity at a crack tip.

Keywords
thermoelectric material, thermal stress, electric current
Milestones
Received: 3 December 2018
Revised: 10 December 2018
Accepted: 16 December 2018
Published: 7 April 2019
Authors
Kun Song
Institute of Aerospace
Nanjing University of Aeronautics and Astronautics
Nanjing
China
Hao-Peng Song
Department of Software Engineering
Nanjing University of Aeronautics and Astronautics
Nanjing
China
Peter Schiavone
Department of Mechanical Engineering
University of Alberta
Edmonton, AB
Canada
Cun-Fa Gao
State Key Laboratory of Mechanics and Control of Mechanical Structures
Nanjing University of Aeronautics and Astronautics
Nanjing
China