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Thermal stress
around an elliptic hole weakened by electric current in an
infinite thermoelectric plate
Kun Song, Hao-Peng Song, Peter Schiavone and Cun-Fa Gao |
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Vol. 14 (2019), No. 1, 179–191
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Abstract |
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We propose effective strategies to manage thermal stress around an elliptic hole induced by electric current and heat flux in a thermoelectric material. Our results indicate that the thermal stress can be reduced dramatically, with little influence on conversion efficiency, by simply adjusting the value of the electric current. In fact, we find that additional electric current in the vertical direction can totally neutralize the thermal stress at a particular point, including the thermal stress singularity at a crack tip. |
Keywords
thermoelectric material, thermal stress, electric current
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Milestones
Received: 3 December 2018
Revised: 10 December 2018
Accepted: 16 December 2018
Published: 7 April 2019
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Authors |
| Kun Song | |
| Institute of Aerospace Nanjing University of Aeronautics and Astronautics Nanjing China |
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| Hao-Peng Song | |
| Department of Software
Engineering Nanjing University of Aeronautics and Astronautics Nanjing China |
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| Peter Schiavone | |
| Department of Mechanical
Engineering University of Alberta Edmonton, AB Canada |
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| Cun-Fa Gao | |
| State Key Laboratory of Mechanics
and Control of Mechanical Structures Nanjing University of Aeronautics and Astronautics Nanjing China |
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