Vol. 16, No. 1, 2021

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Dynamic fracture behavior in functionally graded piezoelectric bimaterials with interfacial cracks emanating from a circular cavity

Ni An, Ming Zhao, Tianshu Song and Haizhu Pan

Vol. 16 (2021), No. 1, 89–104
Abstract

This paper aims to develop an effective method for the dynamic fracture analysis of permeable interfacial cracks emanating from a circular cavity in two dissimilar functionally graded piezoelectric materials (FGPMs) under anti-plane incident SH-wave. The material properties vary exponentially in the same manner along the direction perpendicular to the interface. Green function method, coordinate transformation method, conjunction and crack-deviation techniques are adopted to build mathematical model, so that the crack problem is reduced to solving a set of the first kind of Fredholm’s integral equations and the dynamic stress intensity factors (DSIFs) are expressed theoretically. A comparison is accomplished between the model in this paper and the model with a Griffith crack in FGPMs to verify the validity of the present method. Parametric studies reveal the dependence of DSIFs on the geometry of cavity and cracks, the characteristics of incident wave and the inhomogeneity of materials.

Keywords
functionally graded piezoelectric bimaterials, interfacial cracks, anti-plane incident SH-wave, Green's function, dynamic stress intensity factor (DSIF)
Milestones
Received: 21 October 2020
Revised: 18 January 2021
Accepted: 2 February 2021
Published: 12 May 2021
Authors
Ni An
College of Aerospace and Civil Engineering
Harbin Engineering University
Harbin City, 150001
China
Ming Zhao
College of Aerospace and Civil Engineering
Harbin Engineering University
Harbin City, 150001
China
Tianshu Song
College of Aerospace and Civil Engineering
Harbin Engineering University
Harbin City, 150001
China
Haizhu Pan
College of Computer and Control Engineering
Qiqihar University
Qiqihar City, 161006
China