In the first part of this two-paper series, a new Fragile Points Method (FPM), in
both primal and mixed formulations, is presented for analyzing flexoelectric effects in
2D dielectric materials. In the present paper, a number of numerical results are
provided as validations, including linear and quadratic patch tests, flexoelectric
effects in continuous domains, and analyses of stationary cracks in dielectric
materials. A discussion of the influence of the electroelastic stress is also
given, showing that Maxwell stress could be significant and thus the full
flexoelectric theory is recommended to be employed for nanoscale structures.
The present primal as well as mixed FPMs also show their suitability and
effectiveness in simulating crack initiation and propagation with flexoelectric effect.
Flexoelectricity, coupled with piezoelectric effect, can help, hinder, or deflect the
crack propagation paths and should not be neglected in nanoscale crack
analysis. In FPM, no remeshing or trial function enhancement are required in
modeling crack propagation. A new Bonding-Energy-Rate (BER)-based crack
criterion as well as classic stress-based criterion are used for crack development
simulations.