Vol. 16, No. 4, 2021

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The evolution of intragranular microcracks caused by interface migration induced by electromigration

Huang Shiqian and Huang Peizhen

Vol. 16 (2021), No. 4, 487–500
Abstract

Based on the theory of interface migration, a finite-element method is established to simulate the intragranular microcrack evolution in interconnects induced by electromigration. The agreement between the finite element solution and the numerical solution of the thermal grooving confirms the availability of the finite element method. The calculations show that the intragranular microcracks have two evolution trends: propagation and shrinkage, and the microcrack morphology tends to be round in the evolution process. In the process of microcracks evolution, the linewidth of the interconnects h̃, the initial aspect ratio of the microcrack β and the electric field χ affect the trend of microcrack evolution, and all of these parameters exist the corresponding critical values χc, βc and h̃c. When χ < χc, β < βc and h̃ < h̃c, the intragranular microcrack shrinks. Otherwise, it propagates. Moreover, the decrease of the initial aspect ratio, the linewidth or the electric field is conducive to accelerate microcrack shrinkage. The increase of the initial aspect ratio, the linewidth or the electric field is conducive to microcrack propagation conversely.

Keywords
finite element method, interface migration, microcrack evolution, interconnects, electromigration
Milestones
Received: 31 January 2021
Revised: 6 June 2021
Accepted: 11 June 2021
Published: 9 November 2021
Authors
Huang Shiqian
State Key Laboratory of Mechanics and Control of Mechanical Structures
Nanjing University of Aeronautics and Astronautics
Nanjing, 210016
China
Huang Peizhen
State Key Laboratory of Mechanics and Control of Mechanical Structures
Nanjing University of Aeronautics and Astronautics
Nanjing, 210016
China