Under high current density loading, the crossing grain boundary behavior and the
morphological evolution of inclusions in polycrystalline interconnects affect the
performance and service life of interconnects. Combined with an adaptive meshing
technique and the finite element method, a multi-phase-field model under anisotropic
interface diffusion induced by electromigration is developed to analyze the
inclusion crossing behavior. The results indicate that increasing the conductivity
ratio will suppress the inclusion splitting and hinder its crossing process.
Increasing the anisotropy strength will hinder the inclusion crossing process
and lead to three distinct drift modes: steady drift, oscillatory drift, and
tilted drift. Increasing the electric field strength will accelerate the oscillation
process of the inclusion surface. Increasing the misorientation of fast interface
diffusion direction concerning the electric field in right-side or left-side grain will
change the splitting position, which influences the crossing behavior. This
study helps to reveal the different modes of inclusion crossing behavior in
interconnects.
