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In  Forthcoming  Issues
Testing and simulation of mixed-mode debond failure behaviour of a bonded composite joint

Gang Li, Guillaume Renaud, Chun Li

The interpolating EFG method for steady heat conduction problems in anisotropic marerials

Xiaofeng Liu, Fengbin Liu, Heng Cheng

Analysis of band gap structures of thermal wave in functionally graded thermal wave crystal

Zhizhong Yan, Jia-jun Li, Ying-han Wu, Ercong Cheng