Vol. 16, No. 1, 2021

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Dynamic fracture behavior in functionally graded piezoelectric bimaterials with interfacial cracks emanating from a circular cavity

Ni An, Ming Zhao, Tianshu Song and Haizhu Pan

Vol. 16 (2021), No. 1, 89–104

This paper aims to develop an effective method for the dynamic fracture analysis of permeable interfacial cracks emanating from a circular cavity in two dissimilar functionally graded piezoelectric materials (FGPMs) under anti-plane incident SH-wave. The material properties vary exponentially in the same manner along the direction perpendicular to the interface. Green function method, coordinate transformation method, conjunction and crack-deviation techniques are adopted to build mathematical model, so that the crack problem is reduced to solving a set of the first kind of Fredholm’s integral equations and the dynamic stress intensity factors (DSIFs) are expressed theoretically. A comparison is accomplished between the model in this paper and the model with a Griffith crack in FGPMs to verify the validity of the present method. Parametric studies reveal the dependence of DSIFs on the geometry of cavity and cracks, the characteristics of incident wave and the inhomogeneity of materials.

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functionally graded piezoelectric bimaterials, interfacial cracks, anti-plane incident SH-wave, Green's function, dynamic stress intensity factor (DSIF)
Received: 21 October 2020
Revised: 18 January 2021
Accepted: 2 February 2021
Published: 12 May 2021
Ni An
College of Aerospace and Civil Engineering
Harbin Engineering University
Harbin City, 150001
Ming Zhao
College of Aerospace and Civil Engineering
Harbin Engineering University
Harbin City, 150001
Tianshu Song
College of Aerospace and Civil Engineering
Harbin Engineering University
Harbin City, 150001
Haizhu Pan
College of Computer and Control Engineering
Qiqihar University
Qiqihar City, 161006