Vol. 16, No. 3, 2021

Download this article
Download this article For screen
For printing
Recent Issues

Volume 19
Issue 2, 157–302
Issue 1, 1–156

Volume 18, 5 issues

Volume 17, 5 issues

Volume 16, 5 issues

Volume 15, 5 issues

Volume 14, 5 issues

Volume 13, 5 issues

Volume 12, 5 issues

Volume 11, 5 issues

Volume 10, 5 issues

Volume 9, 5 issues

Volume 8, 8 issues

Volume 7, 10 issues

Volume 6, 9 issues

Volume 5, 6 issues

Volume 4, 10 issues

Volume 3, 10 issues

Volume 2, 10 issues

Volume 1, 8 issues

The Journal
About the journal
Ethics and policies
Peer-review process
Submission guidelines
Submission form
Editorial board
ISSN (electronic): 1559-3959
ISSN (print): 1559-3959
Author index
To appear
Other MSP journals
This article is available for purchase or by subscription. See below.
A level-set viscoelastic constitutive model for multi-shape memory polymers and composites

Fei Zhao, Shichen Zhou, Bo Zhou and Shifeng Xue

Vol. 16 (2021), No. 3, 347–370

Multi-shape memory polymers (m-SMP) and their composites, as new kind of smart materials, can change their shapes and keep the deformed states under external forces. When stimulated by specific stimuli, m-SMP and its composite can reversibly return to the original shapes. m-SMP and its composite are widely used in various complex sensing devices, biomedical, aerospace and other intelligent devices due to their advantages of large deformation, high recovery rate, easy configuration and easy adjustment of shape response temperature. In this paper, we established a new three-dimensional constitutive model for m-SMP and its composite by introducing the level-set method into viscoelastic constitutive equations. In this model, we regarded m-SMP and its composite as inhomogeneous bodies consisting of different phases and used the level-set functions to describe the phase transformation relationships. We took dual-shape memory polymer (SMP) and triple-shape memory polymeric composite (TSPC) as examples to illustrate the process of establishing the model. SMP includes two phases, glass phase and rubber phase, and TSPC includes three phases, rubbery–liquid-like phase, rubbery–semicrystalline phase and glass phase. We used the developed constitutive model to numerically simulate the complete shape memory processes and numerically simulate the mechanical behavior of each process with different correlative rates of SMP and TSPC. The simulation results of shape memory process show that the new constitutive model can describe shape memory behaviors accurately with comparing the simulated result and the existing text data. And the simulation results of each process reflect that the shape memory process has a strong rate correlation. The constitutive model established in this paper can provide a theoretical basis for the application of SMP and TSPC, and can be further extended to m-SMP and its composite.

PDF Access Denied

We have not been able to recognize your IP address as that of a subscriber to this journal.
Online access to the content of recent issues is by subscription, or purchase of single articles.

Please contact your institution's librarian suggesting a subscription, for example by using our journal-recom­mendation form. Or, visit our subscription page for instructions on purchasing a subscription.

You may also contact us at contact@msp.org
or by using our contact form.

Or, you may purchase this single article for USD 45.00:

shape memory polymer, shape memory polymeric composite, level-set method, viscoelastic constitutive equation, constitutive model
Received: 6 August 2020
Revised: 3 December 2020
Accepted: 28 February 2021
Published: 10 August 2021
Fei Zhao
College of Pipeline and Civil Engineering
University of Petroleum (East China)
Qingdao, 266580
Shichen Zhou
College of Pipeline and Civil Engineering
University of Petroleum (East China)
Qingdao, 266580
Bo Zhou
College of Pipeline and Civil Engineering
University of Petroleum (East China)
Qingdao, 266580
Shifeng Xue
College of Pipeline and Civil Engineering
University of Petroleum (East China)
Qingdao, 266580