#### Vol. 16, No. 4, 2021

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The evolution of intragranular microcracks caused by interface migration induced by electromigration

### Huang Shiqian and Huang Peizhen

Vol. 16 (2021), No. 4, 487–500
##### Abstract

Based on the theory of interface migration, a finite-element method is established to simulate the intragranular microcrack evolution in interconnects induced by electromigration. The agreement between the finite element solution and the numerical solution of the thermal grooving confirms the availability of the finite element method. The calculations show that the intragranular microcracks have two evolution trends: propagation and shrinkage, and the microcrack morphology tends to be round in the evolution process. In the process of microcracks evolution, the linewidth of the interconnects $\stackrel{̃}{h}$, the initial aspect ratio of the microcrack $\beta$ and the electric field $\chi$ affect the trend of microcrack evolution, and all of these parameters exist the corresponding critical values ${\chi }_{c}$, ${\beta }_{c}$ and ${\stackrel{̃}{h}}_{c}$. When $\chi <{\chi }_{c}$, $\beta <{\beta }_{c}$ and $\stackrel{̃}{h}<{\stackrel{̃}{h}}_{c}$, the intragranular microcrack shrinks. Otherwise, it propagates. Moreover, the decrease of the initial aspect ratio, the linewidth or the electric field is conducive to accelerate microcrack shrinkage. The increase of the initial aspect ratio, the linewidth or the electric field is conducive to microcrack propagation conversely.

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