|
|||||
 |
|
|
|
|
|
|
|
Phase-field
simulation of conductive inclusion evolution in highly
symmetric oriented single crystal metal interconnects under
anisotropic interface diffusion induced by
electromigration
Congcong Dong and Peizhen Huang |
|
Vol. 19 (2024), No. 3, 373–395
|
Abstract |
|
The research on the electromigration behavior of inclusions has a significant impact on extending the lifespan of interconnects and tuning the required nanopatterns or nanostructures. The electromigration behavior of conductive inclusions in highly symmetric oriented single crystal metal interconnects is studied in this paper utilizing phase-field simulation combined with adaptive mesh technology and the finite element method. Facet-central-cubic metal allows us to investigate the effects of misorientation and anisotropic strength on the morphological evolution of inclusions under highly symmetric orientation. Meanwhile, the relationship between the above two parameters is explored by establishing the morphological evolution maps. The results indicate that three main evolution patterns and their combination patterns emerge during the electromigration process: steady migration, complex splitting, oscillation, splitting before steady migration and splitting before oscillating. Furthermore, the velocity of a steady migration of inclusions, the frequency of oscillation, and the number of splitting generation inclusions decrease as anisotropic strength increases. |
PDF Access Denied
We have not been able to recognize your IP address
18.188.103.162
as that of a subscriber to this journal.
Online access to the content of recent issues is by
subscription, or purchase of single articles.
Please contact your institution's librarian suggesting a subscription, for example by using our journal-recommendation form. Or, visit our subscription page for instructions on purchasing a subscription.
You may also contact us at
contact@msp.org
or by using our
contact form.
Or, you may purchase this single article for USD 45.00:
Keywords
interconnects, electromigration, inclusion, phase-field
simulation, highly symmetric orientation, anisotropic
interface diffusion
|
Milestones
Received: 15 May 2023
Revised: 6 October 2023
Accepted: 9 December 2023
Published: 27 March 2024
|
Authors |
| Congcong Dong | |
| State Key Laboratory of Mechanics
and Control of Mechanical Structures Nanjing University of Aeronautics and Astronautics Nanjing China |
|
| Peizhen Huang | |
| State Key Laboratory of Mechanics
and Control of Mechanical Structures Nanjing University of Aeronautics and Astronautics Nanjing China |
|
| © 2024 MSP (Mathematical Sciences Publishers). |
